Organic electroluminescence device (OELD) is a new type of flat display device newly developed. It has a low turn-on and drive voltage, and can be driven by DC voltage. It can be matched with large-scale integrated circuits, and it is easy to achieve full color and luminous brightness. High (> 105cd / m2) and other advantages, but the service life of OELD devices can not meet the application requirements, one of the technical difficulties that need to be resolved is the device packaging materials and packaging technology. At present, silicone modified epoxy resins are widely used in foreign countries (Japan, the United States, Europe, etc.), which can reduce the internal stress of epoxy resins and form molecules through blending, copolymerization or grafting reactions between the two. Internal toughening, improve high temperature resistance, and also improve the waterproof, oil and oxygen resistance of the silicone, but it requires a longer curing time (several hours to days), to accelerate the curing reaction, higher Temperature (60 ° C to 100 ° C or more) or increasing the amount of curing agent, which not only increases costs, but also is difficult to meet the requirements of large-scale device production lines for packaging materials (short time, room temperature packaging). The surface-actively treated fumed silica is fully dispersed in the silicone-modified epoxy resin encapsulant matrix, which can greatly shorten the curing time of the packaging material (2.0-2.5h), and the curing temperature can be reduced to room temperature. So that the sealing performance of OELD devices is significantly improved and the service life of OELD devices is increased.