Fomed silica (fumed silica) plays a crucial role in high-end electronic packaging as an important nanomaterial. With the miniaturization and high performance of electronic devices, surface modification technology for fumed silica is also showing new development trends.

Current Application Status of Fumed Silica in Electronic Packaging Materials
Fomed silica is mainly used in silicone-modified epoxy resin systems in electronic packaging materials. By fully dispersing surface-treated nano-silica in the silicone-modified epoxy resin encapsulant matrix, the curing time of the encapsulation material can be significantly shortened (from several hours to 2-2.5 hours), while simultaneously lowering the curing temperature to room temperature. This significantly improves the sealing performance of OLED (organic electroluminescent) devices and extends their service life.

In the field of high-end electronic packaging, the application value of fumed silica is mainly reflected in: improving the mechanical properties of packaging materials; enhancing the heat resistance of packaging materials; strengthening the sealing performance of packaging materials; and reducing the temperature requirements of packaging processes.

The main technical methods for surface modification of fumed silica are as follows:
Coupling agent modification: Using silane coupling agents (such as Si69, A151, etc.) to treat the surface of fumed silica improves its compatibility with matrices such as rubber.

Surfactant modification: Adding surfactants to form a network structure in fumed silica increases its specific surface area and oil absorption performance.
Surface grafting polymer modification: Grafting macromolecular polymers with the same properties as the matrix polymer onto the surface of fumed silica using chemical grafting methods.
Ionic liquid modification: Using room temperature ionic liquids as modifiers, which has the advantage of being environmentally friendly but has relatively poor modification effects.
Macromolecular interface modification: Using macromolecular polymers containing polar groups as modifiers.

Recent Advances in Surface Modification Research
In recent years, significant progress has been made in the surface modification technology of fumed silica:
**Innovative Modification Processes:** Developed countries worldwide have widely adopted dry-process modification of fumed silica. This process is simple, requires fewer post-processing steps, and is easily scalable for mass production.
**Development of Novel Modifiers:** Various high-efficiency modifiers have been researched and developed, such as silane coupling agents, siloxane coupling agents, and silazane coupling agents.
**Multifunctional Modification Technology:** Composite modification processes are used to achieve polymer grafting modification and effective dispersion of agglomerates on the surface of nano-silica.
**Green Modification Technology:** Environmentally friendly technologies such as ionic liquid modification are under research and meet the requirements of green production.
**Future Development Trends:** The future development trend of fumed silica surface modification technology will be as follows:
**High Performance:** Development of modified fumed silica with special functions to meet the special needs of high-end electronic packaging materials.
**Green and Environmentally Friendly:** Adoption of more environmentally friendly modification processes and modifiers to reduce pollution during production.
**Multifunctional Integration:** Surface modification enables the integration of multiple functions, such as simultaneous enhancement, thickening, and thixotropic properties.
**Process Optimization:** Continued optimization of the dry modification process reduces production costs and improves efficiency.
**Application Expansion:** With the development of technologies such as 5G and the Internet of Things, the application of fumed silica in novel electronic packaging materials will further expand.

In summary, surface modification technology for fumed silica in high-end electronic packaging materials is developing towards high performance, multifunctionality, and environmental friendliness, and will play an increasingly important role in the electronic packaging field in the future.