Recently, hydrophobic silica, as an important inorganic new material, has shown strong development momentum in the market. With the advancement of technology and the continuous improvement of industrial demand, hydrophobic silica has found new application space in many fields due to its unique hydrophobicity, low moisture absorption, and good dispersibility.
It is reported that hydrophobic silica is surface treated through a special process to attach non hydrolyzable methyl groups to its surface, resulting in hydrophobicity. This material not only cannot be wetted by water, but also has characteristics such as non decomposition, non combustion, and non oxidation at high temperatures. Therefore, it is widely used as a reinforcing agent for silicone rubber, a filler for plastics, and a thickener for coatings and inks.
In the field of electronic packaging materials, hydrophobic silica plays an important role. By fully dispersing it in the organic silicon modified epoxy resin encapsulation adhesive matrix, the curing time of the encapsulation material can be significantly shortened, and the curing temperature can be reduced, thereby improving the sealing performance and service life of the device. This innovative application not only provides a new solution for the packaging of electronic devices, but also opens up a new path for the market expansion of hydrophobic silica.
In addition, hydrophobic silica has shown broad application prospects in industries such as coatings, plastics, and rubber. It can improve the washability and weather resistance of coatings, make plastics denser and enhance waterproof performance, while also providing excellent strength and wear resistance for rubber products.
With the continuous advancement of technology and the increasing industrial demand, the market prospects of hydrophobic silica will become even broader. In the future, we look forward to seeing more innovative applications emerge, injecting new vitality into the development of the hydrophobic silica industry.