Against the backdrop of accelerated localization of semiconductor materials, Yak Technology announced that its independently developed domestic high-end spherical silicon dioxide semiconductor powder material project has officially entered the mass production stage. The successful implementation of this project marks another major breakthrough in the field of semiconductor materials in China, which is of great significance for improving the self-sufficiency rate of China's semiconductor industry chain and reducing dependence on external supply chains.
It is reported that the spherical silicon dioxide product is mainly used in the CMP (chemical mechanical polishing) process in integrated circuit manufacturing, which can effectively improve the flatness of the chip surface and is one of the key materials to enhance chip performance. Yak Technology has broken through key technical bottlenecks such as material purity and particle size distribution through independent research and development, and its product performance has reached the international advanced level.
This mass production will not only further consolidate Yak Technology's leading position in the field of semiconductor materials, but also provide strong support for the independent and controllable development of China's semiconductor industry chain. In the future, Yak Technology will continue to increase its research and development investment in the field of semiconductor materials, and promote the localization process of more high-end materials.