Application of white carbon black in electronic packaging materials
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Application of white carbon black in electronic packaging materials:
Electronic packaging materials: In the packaging of organic electroluminescent devices (OELDs) and other electronic devices, the surface active treated gas-phase white carbon black is fully dispersed in the organic silicon modified epoxy resin packaging adhesive matrix, which can significantly shorten the curing time of the packaging material to 2.0-2.5 hours and lower the curing temperature to room temperature, significantly improving the sealing performance of the device and extending its service life
