In the production and processing of electronic products, the potting process is often used.
The so-called potting is a process in which a liquid gel is mechanically or manually poured into a device containing electronic components and wires, and the gel is solidified into a thermosetting polymer elastomer having excellent properties under normal temperature or heating conditions. It is waterproof, moisture-proof, dust-proof, insulated, heat-conductive, confidential, anti-corrosive, temperature-resistant and shock-proof. These gels for electronic components and line potting are called electronic potting compounds.
According to the chemical composition classification, the current mainstream electronic potting adhesives mainly include epoxy resin electronic potting glue, polyurethane electronic potting glue and silicone electronic potting glue. These three types of electronic potting adhesives have different time appearances, and there are also big differences in product prices and product performance. Here, the silicone electronic potting compound is mainly introduced.
As electronic products have more and more functions, the composition is more and more complicated, but it has to be developed to be light and thin. This requires electronic components and circuits of electronic products to be as highly integrated, miniaturized and light as possible. Quantification, at the same time, because electronic products need to process more programs and run faster, so there is more heat, which puts higher requirements on the thermal and flame retardant properties of various components of electronic products.
In this context, electronic potting compounds for electronic component packaging must have excellent flame retardant and thermal conductivity properties. Silicone electronic potting adhesives have excellent high temperature resistance, weather resistance and electrical insulation, and therefore have a wide range of applications in the packaging of electronic components.
In terms of composition, the electronic potting compound mainly comprises two major parts, one of which is a silicone rubber main body, and the other is a functional filler. The silicone rubber body constitutes the frame of the electronic potting compound and is the main component of the electronic potting compound. The functional filler imparts special properties to the electronic potting compound, such as heat conduction, electrical conductivity, magnetic permeability, flame retardancy, etc. In the heat-conductive flame-retardant electronic potting compound, a flame-retardant and heat-conductive filler is mainly added.