First, the cleaning steps of the material:
This section discusses cleaning solvents and basic cleaning procedures for porous/non-porous materials. The adhesion between the sealant and the substrate depends on whether the surface of the substrate is clean. The user should contact the supplier of the substrate to ensure that this cleaning step and the cleaning solvent selected are compatible with the substrate.
1. Use of organic solvents
Not every solvent can effectively remove every contaminant. Some solvents can severely damage certain materials. Please follow the solvent manufacturer's recommendations for safe use and local or national specifications for solvent use. Please note that IPA (Isopropanol) may not effectively remove contaminants from polyester dust coating materials. It is recommended to clean this material with xylene and white spirit.

2. Non-porous materials
Prior to gumming, the surface of the non-porous material must be cleaned first with a solvent. The choice of solvent will vary with the contaminant and the substrate. Oil-free dust and dirt can be removed by mixing with 50% water and 50% isopropanol. Oily dirt and film should be cleaned with a degreasing solvent such as xylene or white spirit.

3. Porous materials
Building materials such as cement slabs, concrete, granite, limestone, other stone or cementitious materials, substrates capable of absorbing liquids are considered porous materials. For some new porous materials, dusting may be enough. Depending on the surface treatment, the surface of the porous material needs to be cleaned, some need to be cleaned, and some must be cleaned. The degree of scum and dust on the cement board must be cleaned. The fine silicon dust on the surface of the cement substrate, water repellent and other surface treatment residues, protective coatings and old sealants will affect the adhesion of the glue. In order to ensure good adhesion, the above surface residues, coatings and old sealant residues must be removed by grinding. Abrasion cleaning methods include grinding, sawing, sand or water cleaning, mechanical grinding or a combination of the above methods, using wire brushes, vacuum cleaners and oil-free compressed air to remove dust and loose particles from the surface. Once the surface is cleaned and dried, it can be glued. If the surface is dirty, it must be cleaned with a solvent using the “two cloth cleaning method” (detailed later). Some porous materials absorb solvent or primer during the cleaning process and must be volatilized before being applied. Please note that the above-mentioned recommendations for removing old sealants, surface cleaning, interface cleaning and Dow Corning sealants are not suitable for repairing organic sealants and interfaces or other potentially hazardous materials containing PCBS. . If you know or suspect that an existing sealant may have PCB or other dangerous and toxic substances, please contact a professional agency for disposal.

4. "Two cloth cleaning method"
Use a clean, soft, absorbent and lint-free cloth. This cleaning step involves wiping with a cloth dampened with solvent and then wiping it with a second clean cloth.

a) Thoroughly remove loose residue from the surface of the substrate.
b) Pour the solvent of the appropriate purity grade on the cloth. The organic solvent is best placed in a squeeze-resistant solvent-resistant plastic bottle. Never immerse the cloth directly in a solvent-filled container because the cloth is stuck. Dust can contaminate the container.
c) Firmly wipe the surface, check the rag to confirm whether the surface dirt is adsorbed, and use a clean place on the cloth to clean the work until no dirt is adsorbed on the cloth.
d) Immediately wipe the solvent and residue from the substrate with another piece of completely clean dry cloth. The organic solvent must be wiped dry with a dry cloth before volatilization, otherwise it will reduce the cleaning effect. Some materials may have some residual solvent on the surface or climatic conditions. In this case, the surface substrate must be dried before the backing material and small round bar and sealant are installed.

5. Choice of solvent for winter and summer
IPA is soluble in water, so it is ideal for use in winter. It effectively removes condensate and frost from the surface of the substrate. Toluene and xylene are insoluble in water, so they are more suitable for summer use. The primer application steps are as follows:
1. The surface of the material should be clean and dry, and taped around the interface with shielding tape.
2. Pour some primer into a small, clean container. Make sure to tighten the primer can. To prevent the primer from failing, do not pour more than ten minutes of primer into the container.
3. Depending on the material and site conditions, there are two different ways to apply the primer. The best way to use it is to pour the primer onto a clean cloth and apply the primer evenly over the surface of the substrate. For surfaces that are difficult to apply or rough, a primer can be applied with a primer. WARNING: Excessive primer can cause loss of adhesion between the glue and the primer. If too much primer is applied, a powdery, white dust film will appear on the surface of the substrate. Excess excess primer can be removed with a clean, dry and lint-free cloth or non-wire brush before applying the glue.
4. The solvent of the primer should be evaporated and dried before applying the sealant. The volatilization time varies from five to ten minutes, depending on the temperature and humidity.
5. Check that the surface of the substrate is dry. If too much primer is applied, a powdery film will form on the surface of the material.
6. After the above steps are completed, the material surface can be placed on the backing material small round bar and the sealant. The sealant shall be applied on the same day as the primer. If the primer is not on the same day as the sealant, the surface must be re-polished and re-primed before the glue is applied. Do not apply the primer to the small round bar. If the primer can lid is not tight, it will cause the primer to react quickly with the air, reducing the effect of promoting adhesion.


Second, the installation of the backing small round bar


1. Mobile interface design considerations, when designing a mobile interface, the following points must be noted:
- The recommended interface width is at least 6mm. A wider interface allows for a larger displacement capability than a narrower interface.
- Three-sided adhesion will limit the original displacement ability of the interface, which can be avoided with a small round bar or anti-adhesive tape. If the three sides are stuck, the sealant can withstand a displacement of no more than –15%.
- Thinner adhesives can withstand greater displacement and provide optimum displacement when the shape of the interface is hourglass.
- When the width of the sealant is greater than 25mm, the depth should be controlled to about 12mm, and the thickness of the sealant does not need to be more than 12mm.
2. Interface displacement during glue curing
The one-component sealant needs to react with the moisture in the peripheral air to cure. The change of the interface during the curing of the adhesive will lead to unsightly appearance (interface shrinkage), and because the adhesive properties of the adhesive will form after the adhesive is cured, there is The potential for loss of adhesion. The loss of adhesion due to interface displacement during gel curing can be minimized using a primer that reduces the time required for adhesive cure.
The following suggestions help to reduce the deformation of the rubber surface:
a) Use an open-celled polyurethane round bar.
b) Try to glue in the evening because the surface temperature of the substrate is not high and the temperature difference is small.
c) The glue should not be more than 6mm thick. The above suggestions help to reduce the surface shrinkage, but it may not be completely eliminated. In fact, all the sealants may occur due to the deformation of the adhesive due to the displacement of the interface during the curing of the adhesive.