Basic Composition and Types of Electronic Potting Compounds
Electronic potting compounds are mainly composed of a base resin and functional fillers. Common types include:

Epoxy Resin Potting Compounds: Offer excellent adhesion, chemical resistance, and mechanical strength, suitable for applications requiring high durability, but with relatively weak resistance to thermal changes.

Silicone Potting Compounds: Possess high flexibility and excellent thermal stability, ideal for high-temperature applications, commonly used in the automotive and aerospace industries.

Polyurethane Potting Compounds: Combine mechanical strength and elasticity, with an operating temperature up to 125℃, and properties between silicone grease and epoxy potting compounds.

Factors Affecting Thermal Conductivity and Improvement Methods
Factors Affecting Thermal Conductivity
* Filler Type: Metal oxides (e.g., aluminum oxide, aluminum nitride), metal powders (e.g., copper powder, aluminum powder), etc., affect thermal conductivity.
* Filler Content: Higher content generally results in better thermal conductivity.
* Filler Dispersion: Dispersion directly affects thermal conductivity.

Improvement Methods
* Use high thermal conductivity fillers such as alumina thermally conductive powder.
* Optimize filler composition and distribution; new generation potting compounds can achieve a thermal conductivity of up to 2.0 W/m·K.
* Use novel fillers such as organosilicon-modified silicon carbide.
* Modify filler selection through powder surface treatment.

BaiGao Potting Compound: Balancing Strategy Between Anti-settling and Thermal Conductivity
Filler Optimization: Organosilicon-modified silicon carbide is used, and the surface-grafted polymer molecular chains have excellent interfacial compatibility with vinyl silicone oil. High thermal conductivity powder and low-density powder treatment are employed to reduce specific gravity while maintaining good thermal conductivity.

Additives: Anti-settling agents and coupling agents are added to improve the stability of the potting compound. Surfactants are used to improve the compatibility between fillers and solvents.

Process Control: The stirring speed is controlled at 300-500 rpm to reduce air entrapment. Components A/B are warmed at 20-25℃ for 2-4 hours before mixing. A "clockwise stirring for 3 minutes + counterclockwise stirring for 3 minutes" method is used to ensure uniform mixing.