White carbon black: the "nano cornerstone" of electronic materials

In TSMC's 3nm chip packaging workshop, a black adhesive film is protecting wafers worth billions of dollars - its core component is nano white carbon black. This material with a particle size of<10nm increases its thermal conductivity from 0.2W/m · K to 1.5W/m · K by filling polymer gaps, while maintaining insulation, solving the heat dissipation problem of high-power chips.


The 5G era places higher demands on materials. In the base station antenna cover, gas-phase white carbon black is used as an anti reflective agent to increase the signal transmittance from 85% to 92%; In the coating of lithium battery separators, precipitated white carbon black reduces the internal resistance of the battery by 15% and extends the cycle life by 20% by constructing a three-dimensional network structure.


The forefront of technology focuses on composite functionalization. The "Silica Graphene" composite material developed by Shin Etsu Chemical in Japan combines white carbon black with graphene to achieve a thermal conductivity of over 5W/m · K while maintaining insulation of 10 ¹⁶Ω· cm, making it an ideal packaging material for next-generation power devices. By 2025, the global market size of white carbon black for electronic use will reach 800 million US dollars, with an annual growth rate of over 20%.