White carbon black: the "nanoscale insulation barrier" for semiconductor packaging
With the popularization of 5G communication and artificial intelligence technology, the demand for high thermal conductivity and low dielectric loss packaging materials in electronic devices has surged. High purity electronic grade white carbon black (purity>99.9999%) is prepared by plasma vapor phase method and can be uniformly dispersed in silicone epoxy resin, reducing the curing time from 2 hours to 10 minutes and lowering the curing temperature to room temperature. This characteristic makes it a core material for chip packaging and high-frequency PCB substrates, with an annual demand growth rate of 25% and a unit price that can reach 3-5 times that of ordinary products.


Chinese companies are accelerating breakthroughs in this field. Lianke Technology has successfully entered the supply chains of international semiconductor giants such as Intel and TSMC by reducing the product consistency coefficient of variation (CV) to below 3% through its independently developed continuous precipitation process. By 2025, with the implementation of the US Chip and Science Act, the global market size of electronic grade white carbon black is expected to exceed $1.5 billion, and the market share of Chinese companies will increase from the current 15% to 30%.