(1) Rubber tire processing release agent

The emulsion type silicone release agent used in rubber tire molding process uses methyl silicone oil or benzyl silicone oil, base-terminated silicone oil and a small amount of silicone resin with active reactive groups (silicon via) as the host polymer. An emulsion type silicone release agent prepared by adding an appropriate amount of an alkoxysilane crosslinking agent and an organotin silicate catalyst, and adding an additive such as a wetting agent and a bactericide, and adding water to emulsify. The release agent has stable storage, good demolding effect and long service life. It is used for the forming process of pneumatic tires or semi-pneumatic tires. The outer surface of the tire is peeled off from the surface of the steel film with low friction, and the inner surface of the tire is separated from the airbag.
Good slipperiness.
The use of a high-boiling substance and a low-boiling substance fractionated by methylchlorosilane monomer to prepare a silicone polymer, and a release agent for producing a rubber-plastic product can also achieve a fairly good use effect.

(2) Aerosol type silicone release agent
Most of the aerosol type silicone release agent adopts silicone oil with appropriate viscosity as the main silicone polymer, and is combined with a wetting agent, a propellant and the like, and is sealed in a metal can with a spraying device, and the ejection button is used. The release agent is sprayed into the working surface of the mold in the form of fine droplets, and the propellant is volatilized to form a working film of the release agent. The aerosol type silicone release agent is convenient to use, and is mainly used for molding small-sized fine rubber and plastic parts and plastic packaging of electronic components.
The aerosol-type silicone release agent is blended with different degrees of silicone oil to improve the release effect and increase the number of effective demolding of each spray film. If the water-soluble polyether modified silicone oil is used as the main component of the release agent, the obtained silicone release agent does not affect the subsequent hek coating performance of the release product.

(3) Aramid cloth mold supporting high temperature silicone release agent
Aramid heat resistance up to 350 C, high mechanical strength, aramid cloth as a mold hot-pressed wood chipboard, high production efficiency, which is currently the preferred fiberboard advanced molding process. However, the anti-exfoliation performance of aramid cloth is not good. In order to prevent the knotting of the knotting agent and the aramid cloth mold, it is not suitable to use a variety of mold release agents. The high temperature resistance of most release agents does not match the aramid cloth. . The release agent using a common silicone base material has good heat resistance, but the general-purpose silicone resin is cured and the paint film is retracted, and the mold release is not exerted.
The high-curing active methylphenyl silicone resin developed by the author using special synthetic technology not only has the high heat resistance of the usual methyl phenyl silicone resin, but also has high curing activity, and the coating film and the substrate are firmly adhered after curing. And the cured paint film will never return to the outstanding advantages. The high-curing active methylphenyl silicone resin is coated on the aramid cloth. After heat curing, the silicone resin film is firmly adhered to the aramid cloth, and after being subjected to high-temperature molding for a long period of operation, the mold release is maintained excellent. performance.

(4) High temperature resistant non-migratory silicone release agent for aerospace engineering
High-performance fiber composites for aerospace engineering applications have high molding temperatures and molded products that require reliable He-junction performance. The release agent for such composite molding is extremely demanding: in addition to requiring high molding precision and small release force of the product, it is also required that the working temperature of the release agent reaches 180 ° C or higher, and even the processing temperature of individual workpieces is as high as possible. 4000C, at the same time requires that the release agent components should not migrate to the parts, so as not to affect the subsequent entanglement processing. The author uses special composite silicone resin as the base polymer, combined with high temperature resistant wetting agent and compound solvent, to obtain the release agent which fully meets the above demanding requirements. The release agent has good leveling property, and the coating film can be repeatedly used repeatedly after being heated and cured at 150 ° C to maintain the reliable mold release performance of high temperature resistance and non-migration. This mold release agent is widely used in the processing of various aerospace engineering composite materials due to its high efficiency and high reliability.

(5) High-efficiency dip coating anti-heavy release agent
When an electronic component is impregnated with a liquid resin such as an epoxy resin, it is often difficult to remove the metal lead of the packaged liquid resin. If mechanical scraping is used, it is not only inefficient, but also affects the solderability of the components by scratching the plating on the leads. If the metal lead is pre-coated with a common release agent, the migration of the release agent often causes the impregnated encapsulating resin to be uncoated at the root of the lead and after packaging. The author applied low-surface energy silicone polymer with high cross-linking curing agent component to develop a high-efficiency dip coating anti-corrosion release agent. Applying the release agent to the appropriate part of the metal lead of the electronic component, after curing, the electronic component is immersed in the liquid epoxy resin beyond the pre-coated lead portion of the spacer, and when the electronic component is lifted from the material bath, the original component is attached The epoxy resin pre-coated with the lead portion of the release agent will automatically shrink upward in the direction of gravity, so that the electronic component package is tight and full, and the lead wire is completely free of resin, and the obtained electronic component maintains reliable solderability.