Silicone resin encapsulant
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In the late 1960s, with the development of China's electronics industry, it is necessary to use high-insulation, high-temperature, moisture-proof, non-combustible silicone encapsulants to package large and small power diodes, transistors, resistors. , capacitors, integrated circuits and other electronic devices. Earlier in China, the development of such resins was carried out by Zhang Xinghua and He Jigang of the Institute of Chemistry of the Chinese Academy of Sciences, as well as Zhang Jikai and Li Yansheng of Shanghai Resin Factory. The various products they developed filled the domestic gap.
