The thermal conductive silica gel mainly functions in the heat conduction and heat dissipation function of the heat-generating component. The performance of the ordinary thermal silica gel depends on the aluminum hydroxide component to be incorporated. Of course, the special thermal grease will incorporate an appropriate amount of precious metal oxide. It is mainly composed of four components of polydimethylsiloxane, aluminum hydroxide, quartz powder, methyltrimethoxysilane and chelated titanium.
Thermal silica gel can be classified into three types: oily, creamy and patchy depending on the application.

Thermal Grease:
Thermal grease is one of the three thermal conductivity silica gels. The thermal grease is paste-like, sticky and non-dry. Under normal circumstances, it can be used for more than five years. Thermal grease is mainly used to fill the gap between the CPU and the heat sink. This material is also called a thermal interface material. Its function is to transfer the heat radiated from the CPU to the heat sink, so that the CPU temperature is maintained at a level that can work stably, preventing the CPU from being damaged due to poor heat dissipation and prolonging the service life. Because in the application of the heat sink and the heat conducting device, even the two planes with very smooth surfaces will have gaps when they are in contact with each other. The air in these gaps is a poor medium for heat conduction, which hinders the conduction of heat to the heat sink. Thermal grease is a material that fills these voids and makes heat transfer smoother and faster.
Thermal paste:
The thermal paste is a thermal interface material. The thermal silica gel is a thermal RTV adhesive. It can be cured at room temperature. The color is white or black. It needs to react with the moisture in the air to cure. The thermal paste and thermal grease are the biggest difference. That is, the thermal paste can be cured, and has certain elasticity, adhesion and elongation after curing. The thermal paste has fixing and bonding properties, so it conforms to the general process sealing. The thermal conductivity of the thermal paste is the lowest of the three silicones. It is suitable for the thermal conduction of components such as capacitor resistors, and the bonding between some heat-generating components. It is resistant to acid and alkali, but the operating temperature of the thermal paste is generally high. Not more than 200 ° C.
Thermal patch:
In the industrial use for large-area heat dissipation such as power supply, it is necessary to use a material such as a heat-conductive patch, because the cost of the heat-conductive patch is low, has a dryness, is easy to replace, and has a low thermal conductivity, and the high temperature can reach 300. °C, the low temperature is generally -60 °C. In electronic products, it is generally used for some electronic parts and chip surfaces that generate less heat but are not easy to dissipate heat. It is suitable for simple processing of ordinary devices. On the side of better batteries, thermal pastes are generally attached. At the same time of heat conduction, it can fill the gap between the battery and the outer casing, and play a buffering and stabilizing effect. This material has a low thermal conductivity and is therefore not suitable for high-end electronic products (such as computer CPUs).