1. Mixing process

(1) The main agent and curing agent are used together according to the recommended weight ratio of the product (see package):
Before use, mix the main agent and curing agent fully and evenly, and mix according to the prescribed proportion.

(2) Stir for 2-5 minutes at 1500-2000 rpm. The agitator should be placed slightly below the center of the liquid level, and the depth of the agitator inserted into the rubber is 1/2-2/3 of the height of the glue (the height from the liquid level is the best).

(3) Vacuum defoaming of the rubber material (if necessary) after uniform stirring in order to completely remove the bubbles can be filled.

(4) Components A and B of the open package need to be re-sealed, otherwise the curing performance will be affected.

When mixing, it should go up and down several times to make the material as uniform as possible.

(2) Notes
Before use, check whether the packing of agent B is damaged or not. If it is damaged, replace it and avoid using it.
The main agent should be stirred evenly before use.

(2) Before the adhesive is cured, it should not be exposed to rainwater, solvents, etc. to avoid direct sunlight as far as possible.
If matte effect is needed, the module must be placed in a well ventilated environment.


(4) Before using the same container to mix glue, the residues in the container must be cleaned and the unused materials must be re-sealed.
When it is necessary to attach to a material (such as PC, PCB, etc.), it must be used after the application experiment in advance. According to the situation at that time, sometimes it may be necessary to clean the material.

In most cases, silicone rubber can be used normally between minus 40 and 200 degrees Celsius, but at higher or lower temperatures, it is more important than attachment or sealing materials.

In addition, the curing performance of the glue itself has also changed, and it needs to be fully tested before it can be used.

2. Repair process
(1) After sealing, LED and HID often need to be repaired or reworked for various reasons. The hardness of most non-silica gel materials such as epoxy sealant itself is too high, which will inevitably damage circuit boards or components in the process of disassembly. The LED and HID series sealants can better improve this situation.

(2) When removing silicone rubber, a hard paper cutter can be used to tear off the rubber surface. The adhesive part should be removed from the circuit board by mechanical operation. The residual sealant can be removed after soaking in solvent (toluene, solvent oil, etc.) for 24 hours. When repairing, sandpaper or appropriate lotion (ethanol, solvent oil) should be used to wipe the surface to be repaired to make it rough, which will strengthen the adhesion force to achieve a more complete combination of the repaired parts.