The electronics industry has a variety of technologies, ranging from components, electronic components to complete machine products, with various product forms, and a variety of silicone products are used. For example, the bonding and fixing of electronic components requires silicone adhesive, the potting of electronic components and circuit boards requires silicone potting, and the waterproof sealing of shell joints requires silicone sealant. The three-proof protection of boards, modules and devices requires silicone coating...

Novices often encounter problems such as poisoning, sedimentation, bubbles, poor adhesion, oil emission, volatilization, etc. when using silicone electronic glue. What are the reasons for these problems? How to solve it?

1. Silicone potting compound poisoning
Silica gel poisoning generally occurs on the addition-type electronic potting glue. After the poisoning, the silica gel will not cure. "Glue poisoning" is caused by the contact of the silicone potting glue with certain substances, including: sulfur, Phosphorus, nitrogen, tin, etc. Therefore, when using, avoid contact with organic compounds containing phosphorus, sulfur and nitrogen, or use polyurethane, epoxy resin, unsaturated polyester, condensed room temperature vulcanized silicone rubber and other products together with addition silicone to prevent poisoning and non-curing Phenomenon.

2. Electronic potting glue will not dry in winter
Due to the low temperature in winter, the electronic potting glue is cured very slowly or even for a long time after mixing, so we can increase the curing temperature, and the product can be cured in a 25°C oven.

3. There are bubbles after curing
Improper stirring method brings in air: After AB glue is weighed and mixed separately, it needs to be placed in a vacuum cabinet for defoaming treatment, so that no air bubbles will appear after curing.
If the glue formula is not good, there will be problems such as large glue curing shrinkage, glue solvent or plasticizer during the curing process. At this time, the formula needs to be adjusted.
The viscosity of the glue is high and bubbles are prone to appear in the curing stage, so it must be accurately weighed when preparing the glue, and everything needs to be prepared in strict accordance with the instructions. If the viscosity of the glue is small, the bubbles will float to the surface and disappear by themselves during curing.